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TN2404K/TN2404KL/BS107KL
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
2
1
D u ty Cycle = 0.5
0.2
N otes:
0.1
0.1
0.05
P DM
t 1
t 1
0.01
0.02
Single P u lse
t 2
1. D u ty Cycle, D =
t 2
2. Per Unit Base = R thJA =350 C/ W
3. T JM ? T A = P DM Z thJA(t)
4. S u rface Mo u nted
10 ?4
10 ?3
10 ?2
10 ?1
1
1 0
100
6 0 0
S qu are W a v e P u lse D u ration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
(TO-236, TN2404K only)
1
D u ty Cycle = 0.5
0.2
0.1
N otes:
0.1
0.05
P DM
t 1
t 1
0.02
0.01
t 2
1. D u ty Cycle, D =
t 2
2. Per Unit Base = R thJA = 156 C/ W
3. T JM ? T A = P DM Z thJA(t)
Single P u lse
0.01
0 . 1
1
1 0
1 0 0
1 K
10 K
t 1 ? S qu are W a v e P u lse D u ration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
(TO-226AA, TN2404KL and TO-92-18RM, BS107KL only)
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?72225 .
Document Number: 72225
S12-1767-Rev. C, 23-Jul-12
For technical questions, contact: pmostechsupport@vishay.com
www.vishay.com
5
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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